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Home : July 14 2011 Computer News : 3-D integrated DRAM-on-logic for low-power mobile applications demonstrated

3-D integrated DRAM-on-logic for low-power mobile applications demonstrated
July 14, 2011

Researchers in Belgium have demonstrated the potential of 3-D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications.

Link: http://www.sciencedaily.com/releases/2011/07/110712093631.htm
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