| Home : August 22 2019 Computer News : Intel reveals more about its Lakefield stacked CPU, due to ship in late 2019 |
|
Intel reveals more about its Lakefield stacked CPU, due to ship in late 2019 |
August 22, 2019
Intel executives said Tuesday that its hybrid Lakefield architecture will ship late in the fourth quarter, followed by future revisions that will shrink the design further.Previously, Intel has said only that Lakefield will ship in 2019. Intel
Lakefield is one of the more technically interesting chips that Intel has on its roadmap, made up of a split between an undisclosed Sunny Cove CPU (the same CPU architecture that forms the heart of its Ice Lake chip) and several Tremont Atom cores. At the Hot Chips conference Tuesday at Stanford University, Sanjeev Khushu, a vice president in the Infrastructure and Platform Solutions Group at Intel, said that Lakefield would be the first of successive generations of similar designs.To read this article in full, please click here
Link: https://www.pcworld.com/article/3433258/intel-reveals-more-about-its-lakefield-stacked-cpu-due-to-ship-in-late-2019.html#tk.rss_all
|
|
|
|
|
