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New insulation technique paves the way for more powerful and smaller chips |
September 05, 2019
Researchers have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy.
Link: https://www.sciencedaily.com/releases/2019/09/190904100759.htm
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