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Home : August 27 2014 Computer News : Samsung starts production of 3D DDR4 DRAM modules

Samsung starts production of 3D DDR4 DRAM modules

August 27, 2014

Samsung has started producing 64GB DRAM modules for servers based on emerging DDR4 (double-data rate 4) memory using 3D “through silicon via” (TSV) package technology.The 64GB capacity is the largest for DRAM modules yet, which will improve application performance because data will be kept in memory longer so that bits don’t have to be transferred as often between DRAM and other components such as storage.Memory chips are currently placed horizontally on DIMMs, a technical term for memory modules plugged into motherboards. But memory chips are getting smaller, so stacking them vertically provides an opportunity to make better use of the space available on DIMMs, which is the approach Samsung is taking.To read this article in full or to leave a comment, please click here

Link: http://www.pcworld.com/article/2599700/samsung-starts-production-of-3d-ddr4-dram-modules.html#tk.rss_all
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