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Seeing the next dimension of computer chips |
October 12, 2017
Researchers used a scanning tunneling microscope to image the side-surfaces of 3-D silicon crystals for the first time. The pictures, captured with atomic-level of resolution, can help semiconductor manufacturers build the next generation of computer chips with three-dimensional features.
Link: https://www.sciencedaily.com/releases/2017/10/171010114606.htm
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