| Home : March 28 2012 Computer News : Transparent, flexible '3-D' memory chips may be the next big thing in small memory devices |
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Transparent, flexible '3-D' memory chips may be the next big thing in small memory devices |
March 28, 2012
New memory chips that are transparent, flexible enough to be folded like a sheet of paper, shrug off 1,000-degree Fahrenheit temperatures -- twice as hot as the max in a kitchen oven -- and survive other hostile conditions could usher in the development of next-generation flash-competitive memory for tomorrow's keychain drives, cell phones and computers, scientists say.
Link: http://www.sciencedaily.com/releases/2012/03/120327215551.htm
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